Material Brand

 Shengyi，TUC，EMC，ITEQ，Boyu，NanYA，KB

Layer Count

 1- 28 layers;  HDI  2+N+2

 Laminate Material

 FR-4，High   TG，High CTI，High Frequency，Aluminum   Base , Copper Base

Finished Board Thickness

0.4 - 4.0mm (16 - 158 mil)

Max. Panel Size

 520*1200mm  

Outline Tolerance

 ± 0.10mm

Min. Line Width/Spacing 

 2.5mil (0.064mm)/2.5mil (0.064mm)

Impedance Control 

 +/- 8%   ohm

 Min.   BGA PAD Size

 8mil

 Min.   Spacing between BGA PAD and Track

 3.0mil

Min. Spacing between Hole and   Innerlayer Track

 6mil

Hole Copper Thickness  

 Automotive   PCB: Min.25um；

 Others：Avg.25um  Min.20um（IPC-III）

Surface Copper Thickness

 18um，35um，70um，105um，140um，175um (0.5oz – 5oz)

Min. Drilling Hole 

 Mechanical   Drilling: 0.15mm (6mil); Laser Drilling: 0.1mm(4mil)

 Max. Aspect Ratio

 12:1(Hole>0.30mm); 10:1(Hole≤0.30mm)

Soldermask Color

 Green,   Blue,   Black, White, Yellow, Red, etc.

Min. Soldermask Dam

 0.076mm(3mil)

 Surface Finish

 Immersion Gold，OSP，HASL，LF HASL，Immersion Silver，Immersion   Tin，Gold   Plating